The Tessent Streaming Scan Network software for the Tessent TestKompress software includes embedded infrastructure and automation that decouples core-level DFT (design for test) requirements from the chip-level test delivery resources. This enables a no-compromise, bottom-up DFT flow that can dramatically simplify DFT planning and implementation, while reducing test time up to 4X. With full support […]
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IC testers handle Arm eMRAM compiler IP on Samsung 28-nm FDSOI process technology
A new IC test solution is optimized for the eMRAM (embedded Magnetoresistive Random Access Memory) compiler IP from Arm, built on Samsung Foundry’s 28-nm FDSOI process technology. The new eMRAM test solution is the result of a collaboration between Mentor and Arm. Mentor also has a long track record of working closely with Samsung on […]
Software automates design-for-test tasks in IC development efforts
Tessent Connect is an innovative design-for-test (DFT) automation methodology that delivers intent-driven hierarchical test implementation that helps IC design teams achieve manufacturing test quality goals faster and with fewer resources compared to traditional DFT methods. Today’s advanced IC designs can achieve high defect coverage for manufacturing and in-system test by integrating dedicated on-chip infrastructure such […]
Signal Integrity and high-speed design challenges: interview with Mentor’s Todd Westerhoff
At DesignCon 2019, I met with Todd Westerhoff, HyperLynx high-speed design analysis product manager at Mentor, a Siemens Business. Todd has over 38 years of experience in systems modeling, simulation and signal integrity. Prior to joining Mentor, Todd held senior technical and management roles at SiSoft, Cisco and Cadence. We spent time talking about current […]
Finalists announced for T&M LEAP Awards
Four finalists were announced Friday for the inaugural LEAP Awards’ Test & Measurement Category, comprising a broad array of new advances in instrumentation technology. The competition was scored by a panel of independent technical/engineering judges. This year’s inaugural LEAP Awards competition honored ground-breaking new products that set a new standard for innovation. Judges rated candidates […]
Direct comm between Tessent DFT software and Teradyne testers accelerates silicon bring-up
ATE-Connect technology is now hosted in Tessent SiliconInsight product for IC debug and bring-up. The ATE-Connect technology creates an industry-standard interface to eliminate communication barriers between proprietary, tester-specific software and design-for-test (DFT) platforms. The new technology accelerates debug of IJTAG devices, helps speed up product ramps, and reduces time-to-market for products in 5G wireless communications, […]
A new way to test power electronics modules
by John Isaac, Director of Marketing Programs, Mentor Grahpics Corporation A new method for characteristic measurement and reliability testing of thermally sensitive power electronics modules is more efficient and gets to the problem quicker. With the focus on energy savings, there is a rapidly increasing emphasis on power electronics modules used in reusable energy applications, […]
