A PCI Express 5.0 Mini Cool Edge IO (MCIO) interposer works in combination with Teledyne LeCroy’s Summit family of PCI Express 5.0 protocol analyzers. The new interposer enables engineers to test products that incorporate card edge connectors or cabled connector assemblies that utilize the MCIO mechanical connector with PCIe 5.0, NVM Express (NVMe) or Compute […]
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USB Type-C test coupon fixtures speed scope debug tasks
New USB Type-C High-speed and Sideband Test Coupon Fixtures provide the industry’s first oscilloscope solution for high-speed probing and analysis of an active data link at the USB Type-C connector. Additional connection to a Teledyne LeCroy protocol analyzer provides complete debug capability of any USB Type-C link negotiation failure. USB Type-C devices undergo negotiation when […]
RF test system handles Bluetooth Basic Rate, Extended Data Rate, LE technologies
The FRVS RF test system has been approved by the Bluetooth Special Interest Group (Bluetooth SIG), the governing body for Bluetooth technology, for testing Bluetooth Basic Rate (BR), Extended Data Rate (EDR) and Low Energy (LE) technologies. It is estimated by ABI Research and the Bluetooth SIG that about 4.5 billion Bluetooth enabled devices were […]
Analyzer performs USB4 compliance tests
A USB4 compliance test option for the Voyager M4x analyzer and exerciser system can be used in conjunction with the USB Implementers Forum’s (USB-IF’s) USB4 Command Verifier (USB4-CV) software to generate traffic conditions and verify responses for the official USB4 logical, protocol, and tunneling layer compliance test specifications. USB4 combines the simplicity of the USB […]
MIPI M-PHY High-Speed GEAR 5 UFS 4.0 protocol analyzer/exerciser sports solder-in probes
The Eclipse M52 Analyzer/Exerciser supports the next generation of M-PHY High Speed Gear 5 (HS-G5), UniPro 2.0/UFS 4.0 development and can be configured now with the new GEAR 5 solder-in probes. The Eclipse M52 analyzer/exerciser assists design and test engineers working with the high data rates and aggressive power management of the UniPro and UFS […]
PCI Express 5.0 EDSFF interposers analyze EDSFF E1.S, E1.L, E3.x type SSDs
PCI Express 5.0 EDSFF interposers for analysis of Enterprise & Datacenter Small Form Factor (EDSFF) E1.S, E1.L, E3.x type solid-state drives (SSDs) work in combination with the Summit family of PCI Express 5.0 protocol analyzers to test product designs that utilizes the PCIe 5.0, NVM Express (NVMe) and Compute Express Link (CXL) protocol technologies with […]
PHY interposer supports PCI Express 5.0 CEM spec
The CrossSync PHY technology now supports the PCI Express 5.0 Card Electromechanical (CEM) specification. This new CEM interposer (PE230UIA-X) joins the existing CrossSync PHY enabled M.2 form factor interposers (PE210UIA for PCIe 4.0 and the PE222UIA for PCIe 5.0), with more form factors in development to fill out the portfolio of cross-layer probing. Engineers at […]
DisplayPort 2.0 PHY test setup integrates BERT, analysis of multi-lane 20 Gb/sec video links
The QualiPHY DisplayPort 2.0 source and sink compliance and DisplayPort AUX DME (Decode, Measure & Eye Diagram) oscilloscope software options build on a recently announced industry-leading DisplayPort 2.0 Link Layer compliance test solution. The market demands higher resolution for Virtual Reality and PC displays — up to 16,000 pixels (16K) — and ever faster refresh […]
New scopes sport 12-bit resolution, 15.6-in displays, include waveform generation/spectrum analysis
The HDO6000B Series brings together high sample rate 12-bit ADCs, high signal-to-noise amplifiers and low-noise system architecture. Oscilloscopes with HD4096 technology always provide 12 bits of vertical resolution. “No digitizer is perfect,” says Robert Mart, Teledyne LeCroy’s Director of Product Marketing, “but compared to an 8-bit system, a 12-bit system is 16 times closer to […]
The difference between TDR instruments and scope-based TDR measurements
Often a transmission line is buried, concealed behind finish surfaces, or otherwise not readily accessible. So it is difficult to locate faults by means of visual inspection. It is, however, feasible to locate such discontinuities via a test instrument known as the time domain reflectometer (TDR). The TDR is sometimes compared to a radar installation, […]
