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TMYTEK

Expand your RF test equipment’s range to 20 GHz

July 28, 2023 By Martin Rowe Leave a Comment

Extend the frequency of RF test equipment from 6 GHz to 20 GHz. RF systems such as satellite, Wi-Fi, UWB, and radar often need to bring modulated signals up to carrier frequency before transmitting and after receiving. TMYTEK, maker of BBox has introduced its UD Module (UDM) up/down converter, which operates from 6 GHz to […]

Filed Under: Analyzer, Featured, New Articles, Oscilloscopes, spectrum analyzer, wireless test equipment Tagged With: TMYTEK

IMS 2023 roundup: test equipment

July 3, 2023 By Martin Rowe Leave a Comment

Test equipment plays a major role in product development and production, which was apparent at IMS 2023. In the photos and videos below, you’ll get a taste of test developments at RF, mmWave, and sub-THz frequencies. This year, D-band (110 GHz to 170 GHz) seized a larger portion of the exhibit hall than in past […]

Filed Under: Communication Test, Featured, PC-based spectrum analyzers, spectrum analyzer, vector network analyzer, vector network analyzers, Video, wireless test equipment Tagged With: anritsu, astronics, keysighttechnologies, marvintestsolutions, pickeringinterfaces, rohdeschwarz, siglenttechnologies, signalhound, taborelectronics, TMYTEK

EE World’s 2023 communications handbook is here

May 22, 2023 By Martin Rowe

Our 2023 5G, Wired, & Wireless Handbook is now available in ebook form. Download your copy today. It started on a cold January day with an editorial call. A month later, the abstracts came in. After another month, the manuscripts came in. Then came the editing and some back-and-forth with the authors. Next, it was…

Filed Under: Digital Edition Back Issue Tagged With: Achronix, keysighttechnologies, Littelfuse, microchip, Molex, rohdeschwarz, SiTime, teradyne, TMYTEK

Test methods for mmWave AiP designs bring tradeoffs

April 18, 2023 By Su-Wei Chang, Ethan Lin, Andrew Wu, and Jackrose Kuo, TMYTEK

Engineers have several mmWave over-the-air test methods available for evaluating phased-array antennas used in antenna-in-package designs. Each has pros and cons.

Filed Under: 5G, Digital Edition Back Issue, FAQ, Featured, Featured Contributions, wireless, wireless test equipment Tagged With: TMYTEK

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AI and high-performance computing demand interconnects that can handle massive data throughput without bottlenecks. This Tech Toolbox explores the connector technologies enabling ML systems, from high-speed board-to-board and PCIe interfaces to in-package optical interconnects and twin-axial assemblies.

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